Adhesion in Microelectronics (Adhesion and Adhesives: Fundamental and Applied Aspects)
Adhesion in Microelectronics (Adhesion and Adhesives: Fundamental and Applied Aspects) by K. L. Mittal and Tanweer Ahsan
English | 2014 | ISBN: 1118831330 | 368 pages | PDF | 4 MB
English | 2014 | ISBN: 1118831330 | 368 pages | PDF | 4 MB
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
• Various theories or mechanisms of adhesion
• Surface (physical or chemical) characterization of materials as it pertains to adhesion
• Surface cleaning as it pertains to adhesion
• Ways to improve adhesion
• Unraveling of interfacial interactions using an array of pertinent techniques
• Characterization of interfaces / interphases
• Polymer-polymer adhesion
• Metal-polymer adhesion (metallized polymers)
• Polymer adhesion to various substrates
• Adhesion of thin films
• Adhesion of underfills
• Adhesion of molding compounds
• Adhesion of different dielectric materials
• Delamination and reliability issues in packaged devices
• Interface mechanics and crack propagation
• Adhesion measurement of thin films and coatings