Three-Dimensional Integration and Modeling (repost)
Jong-Hoon Lee, "Three-Dimensional Integration and Modeling"
English | ISBN: 1598292447 | edition 2008 | PDF | 118 pages | 33,9 mb
English | ISBN: 1598292447 | edition 2008 | PDF | 118 pages | 33,9 mb
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.
Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.