Advances in Condition Monitoring and Structural Health Monitoring: WCCM 2019 by Len Gelman
English | PDF | 2021 | 759 Pages | ISBN : 9811591989 | 42.2 MB
This book comprises the selected contributions from the 2nd World Congress on Condition Monitoring (WCCM 2019), held in Singapore in December 2019. The contents focus on digitalisation for condition monitoring with the emergence of the fourth industrial revolution (Industry 4.0) and the Industrial Internet-of-Things (IIoT).