Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Modeling and Design of Electromagnetic Compatibility
for High-Speed Printed Circuit Boards and Packaging
by Xing-Chang Wei
English | 2017 | ISBN: 1138033561 | 341 Pages | PDF | 12 MB
for High-Speed Printed Circuit Boards and Packaging
by Xing-Chang Wei
English | 2017 | ISBN: 1138033561 | 341 Pages | PDF | 12 MB
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.