Electronics Cooling - March 2015English | True PDF | 44 Pages | 4.17 MB
Don’t miss out on the March 2015 issue of Electronics Cooling, which includes feature articles on Design Optimization of a Multi-device Single-phase Branching Microchannel Cold Plate; Circuit Card Assembly Heat Sinks; Thermal Power Plane Enabling Dual-side Electrical Interconnects for High-performance Chip Stacks; Liquid Immersion in the Data Center; and more.
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