ANSYS Electronics Suite 2022 R1

General Electronics Desktop
- Improved scripting API for property queries and edits
- Integration with Granta materials gateway
- Enhancements to fields calculator export
- Improved handling of post-processing variables in Optimetrics
- Enhanced zoom controls for 2D plots
- Enhancements to Network Data Explorer
. Significant speedup when reading large Touchstone files
. Support for limit lines
. Scripting API (Beta)
- 3D Modeler link to Discovery geometry (Beta)
Granta Materials Data for Simulation
l PCB producer materials: Added 47 new records (Dk and Df curves only) and added supplemental properties for 72 existing Rogers records.
HFSS
- Auto Solver option for direct/iterative matrix solver
- Automation for creation of lumped ports
- Improved reliability of convergence for interpolating sweeps
- Improvements for SBR+
. Fast Frequency Looping to accelerate large, uniform frequency sweeps
. Enhanced useability and functionality for VRT filtering
. Rough surface model for Range-Doppler solutions
. Volumetric SBR+ support for combining materials and boundaries
. Radiated power calculations for linked or parametric antennas
. Visualization of conformance for current source antennas
. Visualization of far fields for imported Spherical Wave Expansion (SWE) antennas
- Mixed (model and terminal) ports in the Transient solution type
- Anisotropic materials in implicit Transient solver
- Conducting and dielectric IE region contact
- Improved Secondary Electron Emission (SEE) multipaction models
- Enhancements to Mesh Fusion setup and meshing process (Beta)
- Support for HFSS 3D Layout components in HFSS 3D (Beta)
HFSS 3D Layout
- Enhancements to IC workflow capabilities and useability
- 3D component display and commands in the Project window
- Improved reliability of convergence for interpolating sweeps
- Support for matrix convergence
- Support for differential pair solutions in output variable convergence
- Addition of Volume Loss Density and 3D lines in fields post-processing
- Enhancements to Mesh Fusion setup and meshing process (Beta)
- New broadband fast sweep based on model order reduction (Beta)
- New encrypted 3D Layout components (Beta)
SIwave
- New auto generation of HFSS regions in HFSS 3D Layout (Beta)
- Ability to include temperature-dependent materials for the AC solver
- Enhanced workflows and useability for DDRwizard (Beta)
- Support for multi-layer conductor analysis in Layer Stackup Wizard
- Enhancements to rules and reporting in EMI Scanner
- Enhancements for CPA
. Improved smart pin grouping
. Support for multiple die and PLOC/CPM
. New solution monitoring for the adaptive process
Maxwell
- Commercial release of AC Conduction solver with new features
. Multiphysics coupling
. Support for current excitations in matrix computations
- Multiphysics enhancements
. Inclusion of Litz wire loss in total/integrated loss
. New EM Loss coupling from Maxwell 2D to Icepak and Mechanical in AEDT
. Support for element-based coupling from 2D models with skew (Beta)
. Support for 3D impedance boundary losses
. Ability to export harmonic force to Ansys Mechanical
- Improved performance of expression cache for Transient with parametric distribution
- New resistive sheet in 3D Eddy
- Support Tau mesh in 2D band region
- Improved meshing for 3D models created by Motor-CAD
- Support for electric breakdown and inception voltage in fields post-processing
- Ability to push excitations from Twin Builder to 2D and 3D Transient
- Improved useability and performance of harmonic force calculation and workflows
- Removed most limitations on distributed skew model
- Ability to display motor and generator modes in one efficiency map
- Ability to create induction machine efficiency maps based on speed, slip, and voltage
- New 6-Phase/Poly-Phase ECE model
- Support for magnetization/demagnetization of nonlinear permanent magnets in A-Phi
- Ability to consider core loss effects on magnetic fields in A-Phi
Icepak
- New 2-way Chip Thermal Model workflow with RedHawk
- Ability to import IDX files
. New blower component
. Enhancements for PCB components
. New modeling options for drill holes, board cutouts, and device surfaces
- New ability to collapse/expand device definitions and hide filtered devices
- Support for wirebonds using plate model
- Improved meshing performance and robustness
- Enhancements to network schematic display and useability
- Improved efficiency of converting Classic Icepak projects
Mechanical
- New field summary reporting capability
- Ability to use expressions for temperature-dependent materials
- New slider capability for automatic mesh seeding (Beta)
- Enhancements for Structural solution type (Beta)
. New displacement load
. New pressure/force load
. New coupling to link temperature from Mechanical Thermal
. New coupling to link force from HFSS/Maxwell
Q3D Extractor
- New use of Tau mesh as default for 2D Extractor
- Automatic net detection and validation for AC-RL
- Ability to plot magnetic fields on surfaces for AC-RL
- Ability to export fields to Ensight
- New uniform current terminals for DC-RL
Circuit
Nexxim
- Support for multiple TDR probes
- Improved handling of DC passivity for IFPVLF
- Export PSPICE compatible model from Q3D RLGC Toolkit (Beta)
- Improved sampling of frequency points field solver co-simulation (Beta)
- Support for state-space models in SPISim
- Improved reporting of results from SPISim (Beta)
Ansys FilterSolutions
- Discrete filter optimization (Beta)
EMIT
- Ability to add CAD models and antenna passbands in the Coupling Editor
- Enhanced useability and performance of Results window
- Addition of 4-port and 5-port multiplexers
- Improved import of EMIT Classic projects and libraries
- New Spectrum Utilization Toolkit for visualizing spectrum usage and on-channel co-site

Twin Builder

Modelica Workflow Enhancements
= Support for conditional parameters and connector
= Enhancements for cloning uncompiled models
= Editor support for annotations and documentation
ROMs and ROM Viewer Enhancements
= New browser-based ROM viewer for web apps
= New solver in Dynamic ROM Builder
Export, Deployment, and Digital Twins
= Export Twin as web app
= Export deployable Hybrid Twin (Beta)
= Export Modal ROM from Mechanical
= Export SVD and Mode coefficients for LTI/LPV
= Support for Twin states save/restore through exported Python app
Library/Solver Enhancements
= Extended Linux support for C-models from the system library
= Support for Sparse Matrix format solver in SISO/MIMO toolkit
= State Saving (KRN) for Twin and FMU in Twin Builder
= Support for HPC licensing
= Excitation component (push to Maxwell)
= Improvements to library management
= Simulink co-simulation support for R2020b and R2021a
= Support for Hybrid calibration (Beta)
UI/UX Enhancements
= UI support for directory selector for ROM viz
= Min and max constraints in SRB and DRB
= Search filter for FMU import interface
= New dataset import and management dialog box for Modelica

Circuit
- 333593 Multiple TDR probes in a Circuit design now run independently without interfering with each other.
- 463137 Network Data Explorer now reads the gamma data written in touchstone files.
- 494846 Renaming links in Icepak network schematics no longer crashes Electronics Desktop.
EMIT
- 515609 Enhancements to GPS library models to better model the impact of Rx processing gain on broadband noise.
- 517651 The receiver mixer product model for specific LO injection settings includes a previously omitted, highest-order mixer product.
HFSS
- 506768 Correct Djordjevic models is now generated when bulk conductivity values are large.
- 509927 Delay time is now correct for TDR analysis in the implicit Transient solver.
- 532944 Report quantity MaxNearEPhi, MaxNearETheta, MaxNearEx, MaxNearEy, and MaxNearEz calculations are now correct.
Icepak
- 459253 Mesh operations for fan cutouts are now correctly applied.
- 471433 Trace mapping discrepancies for specific cases are resolved.
- 492300 Fields are now available after solve when 3D components are included.
- 515155 Calculated and imported EM losses now match when facet levels are increased.
Maxwell
- 461696 Consistent current density calculation among Electronics Desktop versions 2019 R2, 2020 R2, and 2021 R1.
SIwave
- 380446 Corrected interpretation of DC permittivity values stored in Electronics Desktop material libraries.
- 446116 Improved handling of DS materials when exporting HFSS or Q3D projects.
- 489794 Introduced user control of DC inductance computation during S-parameter simulation.
- 502105 Corrected issue with default CPA FEM CG solver producing non-converged results for large projects.
- 505774 Improved robustness of transmission line parameter calculations in the SIwave UI for stackups with conformal coats.
Twin Builder
- 471808 SDBCtrl no longer has a memory leak in ReadData API command.

ANSYS.2022R1.ELECTRONICS.WINX64.iso
ANSYS.2022R1.MCADTRANSLATORS.WINX64.iso
ELECTRONICS_LOCAL_HELP_2022R1.iso