ANSYS Electronics Suite 2023 R1

*New 3D Geometry Kernel*
Electronics Desktop now uses the industry standard Parasolid geometry kernel.

General Electronics Desktop
- Ability to export images in non-graphical mode
- Multi-level distribution in large-scale distributed solves
- Batch option to select Intel MPI version
- Property scripting API enhancements
- Improved performance for refinement of large meshes
HFSS
- Support for modal ports and components in terminal designs
- Improved workflows for layout components
- Improved HPC performance for distributed mesh fusion solver
- Iterative solver option for mesh fusion
- Improved performance of domain solver for large arrays
- Option to set phase center at port location
- AMD math libraries with direct matrix solver
- Improved TDR calculation
- Parallel component adaptive for 3D Component arrays (Beta)
- Nonlinear Drude model for plasma density in implicit transient (Beta)
- SBR+ enhancements:
. Custom arrays
. Support for PTD/UTD in advanced doppler processing
. File-based near field
. Near field performance improvements
HFSS 3D Layout
- Etching workflow and robustness improvements
- Arbitrary backdrill depth
- Layout and ECAD usability and performance enhancements
- AMD math libraries with direct matrix solver
- Iterative solver option for mesh fusion
- Improved TDR calculation
- Solution management improvements
- IC Layout mode (Beta)
- Rigid flex multi-zone workflow (Beta)
- Support for wave ports in broadband frequency sweep (Beta)
SIwave
- HFSS region clipping and configuration enhancements
- Robustness improvements for CPA and PSI simulation modes
- Option to explicitly specify trace cross-section orientation
- Workflow and accuracy improvements for s-parameter components
- Signal Net Analyzer report export enhancements
- DCIR field post-processing enhancements
- Validation check performance improvements
- CPA package netlist remapping to fit any chip
- CPA package netlist simplification and resynthesis
- Ability to specify multiple ground nets for VRMs during CPA simulations
Icepak
- Slider bar and HDM meshing enhancements
- Graphical monitoring of batch solves
- Export of heat transfer coefficients in CTM v2
- Export of temperature data from multiple PCBs to Sherlock
- ECXML export
- Support for altitude effects
- Selection of 2D profile interpolation method
- New toolkits for snapping and heat sinks
- New Getting Started Guides: Finned Heat Sink, RF Amplifier, Optimization of Fan Location, and Cold Plate Model
- ROM Delphi support for BGAs (Beta)
- Support for direct post-processing of hybrid meshes (Beta)
Maxwell
- Windings in magnetostatic
- Force density calculation improvements
- Enhanced workflows for co-simulation with Motion
- Support for parallel branches in windings with solid conductors
- Half-axial symmetry for object-based harmonic force in transient
- Improved hp-assignment efficiency for complex geometries in eddy and magnetostatic
- ROM-based efficiency map for induction machines in the electric machine toolkit
- Electric machine toolkit workflow improvements
- Thin layer boundary for 3D DC conduction
- TDM support for different time steps between source and target
- Option to use Lorentz force calculation in 3D transient
- New design setting to skip mesh quality checks
- Band mapping angle meshing for 2D transient (Beta)
Mechanical
- Thermal contacts
- Reference temperature for objects in Structural
Q3D Extractor
- Performance improvements for E and H fields
- Infinite ground plane for CG
- Stability enforcement and passivity check for RLGC SPICE export
- Transition region solver for AC-RL (Beta)
- Distributed memory solver for CG (Beta)

Circuit

General Enhancements:
- Adaptive time-stepping for nonlinear simulations
- Tx/Rx support for IBIS-AMI models
- Virtual EMI test receiver component (Beta)
- Augmented-Data Passivity Enforcement for state-space fitting (Beta)
- Automatic tuning of HFSS 3D Layout ports in NuHertz (Beta)
SPISim:
- Ability to directly enable ERL calculation
- Workflow improvements for SERDES channel compliance
- Ability to specify Tx IBIS models and use slew rate in COM
EMIT
- Results and post-processing API
- Workflow usability enhancements

Twin Builder

Reduced Order Model:
- Linear Static ROM with support for large number of parameters
- Linear Dynamic ROM
- Image generation with geometry deformation for ROMs
Modelica Editor:
- Enhanced bijection (text-to-diagram) support
- Enhanced diagram graphics
General Enhancements:
- Support for Hierarchical parameters in the Model Parameter dialog box
- Model Exchange (ME) FMU support in Twin Deployer
- Support for gradient fitting in device characterization
- Carrier wave options in the SVPWM component
- Automatic pin connection for large components

Granta

Granta Materials Library:
- Ethylene glycol and propylene glycol records are updated with thermal expansion, density vs. temperature, viscosity vs. temperature and molecular data changes
- Missing molecular mass values are populated for all fluids
- Temperature dependent Young’s modulus removed for Plastic, PA12 (rigid)
- Hc value removed for soft magnets
- There are no additional materials/records in the Materials Library in this release, but some property values are updated as a result of bug fixing
Granta Producer Materials Library:
- Added 8 new PCB laminates from two new producers: Arlon and Taconic
- Added 9 new PCB laminates for the existing producers: Rogers, EMC, Shengyi and Ventec
- Added 1 new polymer-elastomer material for the existing producer: Laird
- Gap filled some mechanical and thermal properties.

Electronics Desktop
- 668753 – 2D rectangular plot scale now aligns with actual data.
- 697479 – Resolved negative time in some plots.
EMIT
- 653522 – Resolved EMIT Classic library import problem from 2022 R2.
- 668707 – Intermod equation is now correct for N-1 with multiple amplifiers.
HFSS
- 654756 – Slanted Co and Cross polarization now has corrected formulation.
- 685177 – Font options now correctly appear for Smith Chart.
- 692410 – VRT is now correct with multiple objects and penetrable materials.
HFSS 3D Layout
- 618343 – Fields now correctly plot on mesh fusion component.
Icepak
- 647899 – Conducting Plate Thermal Model with Shell Conduction and anisotropic thermal conductivity of Shell Conduction Zones works as intended.
- 655588 – Via Property Import for Classic Icepak model is now working correctly.
- 673227 – EM Loss visualization on PCBs is now working.
- 688342 – Face monitors can be correctly defined on fan components.
Maxwell
- 690031 – Transient/Harmonic Force Data Extraction calculates correctly when using If command in Time Step.
- 691114 – TransientForce_t() now returns correct data.
Mechanical
- 685199 – Specific designs that failed when "Mechanical Contacts" beta option was enabled now work correctly.
Q3D Extractor
- 685300 – Sink terminal name is now correct after Series matrix reduction.
SIwave
- 510943 – Improvements to PCB hole modeling during SIwave-Icepak thermal simulations.
- 658563 – SIwave validation check performance and robustness improvements.
- 701679 – Improvements to DS material model export fidelity from SIwave to HFSS and Q3D.
Twin Builder
- 663201 – Modelica IDE: Icon graphics from libraries are properly displayed now.
- 708978 – Duplicate library entries in Modelica path are now only loaded once