Wafer Level 3-D ICs Process Technology (repost)
Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif, "Wafer Level 3-D ICs Process Technology"
Spri/nger | 2008 | ISBN: 0387765328 | 410 pages | PDF | 11,1 MB
Spri/nger | 2008 | ISBN: 0387765328 | 410 pages | PDF | 11,1 MB
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging.
This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Download