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    3. RF and Microwave Microelectronics Packaging II (Repost)

    RF and Microwave Microelectronics Packaging II (Repost)

    Posted By: AvaxGenius
    Date: 7 Jun 2022 14:12:17
    RF and Microwave Microelectronics Packaging II (Repost)

    RF and Microwave Microelectronics Packaging II by Ken Kuang
    English | EPUB | 2017 | 186 Pages | ISBN : 3319516965 | 3.7 MB

    This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.
    It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
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