It is our pleasure to present these proceedings for “The Aerodynamics of Heavy Vehicles II: Trucks, Buses and Trains” International Conference held in Lake - hoe, California, August 26-31, 2007 by Engineering Conferences International (ECI). Brought together were the world’s leading scientists and engineers from industry, universities, and research laboratories, including truck and high-speed train manufacturers and operators. All were gathered to discuss computer simu- tion and experimental techniques to be applied for the design of the more efficient trucks, buses and high-speed trains required in future years. This was the second conference in the series. The focus of the first conference in 2002 was the interplay between computations and experiment in minimizing ae- dynamic drag. The present proceedings, from the 2007 conference, address the development and application of advanced aerodynamic simulation and experim- tal methods for state-of-the-art analysis and design, as well as the development of new ideas and trends holding promise for the coming 10-year time span. Also - cluded, are studies of heavy vehicle aerodynamic tractor and trailer add-on - vices, studies of schemes to delay undesirable flow separation, and studies of - derhood thermal management.

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Symmetric Galerkin Boundary Element Method presents an introduction as well as recent developments of this accurate, powerful, and versatile method. The formulation possesses the attractive feature of producing a symmetric coefficient matrix. In addition, the Galerkin approximation allows standard continuous elements to be used for evaluation of hypersingular integrals.

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The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.

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