Microsystems are an important factor that contribute to an automobile model's success. To meet the customers's desire for safety, convenience and vehicle economy, and to satisfy environmental standards, microsystems are the critical factor. Microsystems applications (MST) have already resulted in improved performance and better value for money. But the advances implemented reveal only the beginning of a revolution in the vehicle sector, which aims at a complete transition from the mechanically driven automobile system to a mechanically based but ICT-driven system. The selected contributions from AMAA 2003 treat safety (both preventive and protective), powertrain (online measurement and control of engine and transmission subsystems), comfort and HMI (systems to enhance the comfort of passengers and human machine interface issues), and networked Vehicle (all aspects of intra car systems and ambient communication networks). Selected proceedings for the seventh conference on microsystems in the automotive sector, a regular event now with an increasing number of participants on a modern and promising field taking place in Berlin in May 2003.

The book presents the best contributions, extracted from the theses written by the students who have attended the second edition of the Master in Microelectronics and Systems that has been organized by the Universita degli Studi di Catania and that has been held at the STMicroelectronics Company (Catania Site) from May 2000 to January 2001. In particular, the mentioned Master has been organized among the various ac­ tivities of the "Istituto Superiore di Catania per la Formazione di Eccellenza". The Institute is one of the Italian network of universities selected by MURST (Ministry University Research Scientific Technology). The first aim of tl;te Master in Microelectronics and Systems is to increase the skills of the students with the Laurea Degree in Physics or Electrical Engineering in the more advanced areas as VLSI system design, high-speed low-voltage low-power circuitS and RF systems. The second aim has been to involve in the educational program companies like STMicroelectronics, ACCENT and ITEL, interested in emergent microelectronics topics, to cooperate with the University in developing high-level research projects. Besides the tutorial activity during the teaching hours, provided by national and international researchers, a significant part of the School has been dedicated to the presentation of specific CAD tools and experiments in order to prepare the students to solve specific problems during the stage period and in the thesis work.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

This book showcases the state of the art in the field of electronics, as presented by researchers and engineers at the 54th Annual Meeting of the Italian Electronics Society (SIE), held in Noto (SR), Italy, on September 6–8, 2023. It covers a broad range of aspects, including: integrated circuits and systems, micro- and nano-electronic devices, microwave electronics, sensors and microsystems, optoelectronics and photonics, power electronics, electronic systems and applications.

This book showcases the state of the art in the field of electronics, as presented by researchers and engineers at the 54th Annual Meeting of the Italian Electronics Society (SIE), held in Noto (SR), Italy, on September 6–8, 2023. It covers a broad range of aspects, including: integrated circuits and systems, micro- and nano-electronic devices, microwave electronics, sensors and microsystems, optoelectronics and photonics, power electronics, electronic systems and applications.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

This Briefs volume describes the properties and structure of elementary excitations in isotope low-dimensional structures. Without assuming prior knowledge of quantum physics, the present book provides the basic knowledge needed to understand the recent developments in the sub-disciplines of nanoscience isotopetronics, novel device concepts and materials for nanotechnology. It is the first and comprehensive interdisciplinary account of the newly developed scientific discipline isotopetronics.

This book presents basic and advanced concepts for energy harvesting and energy efficiency, as well as related technologies, methods, and their applications. The book provides up-to-date knowledge and discusses the state-of-the-art equipment and methods used for energy harvesting and energy efficiency, combining theory and practical applications.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

This book describes the substantial progress recently made in the development of micro and nanorobotic systems, utilizing magnetic, optical, acoustic, electrical, and other actuation fields. It covers several areas of micro and nanorobotics including robotics, materials science, and biomedical engineering. Field-Driven Micro and Nanorobots for Biology and Medicine provides readers with fundamental physics at the micro and nano scales, state-of-the-art technical advances in field-driven micro and nanorobots, and applications in biological and biomedical disciplines.

Inorganic nanoparticles are among the most investigated objects nowadays, both in fundamental science and in various technical applications. In this book the physical properties of nanowires formed by nanoparticles with elongated shape, i.e. rod-like or wire-like, are described. The transition in the physical properties is analyzed for nanorods and nanowires consisting of spherical and rod-like nanoparticles. The physical properties of nanowires and elongated inorganic nanoparticles are reviewed too. The optical, electrical, magnetic, mechanical and catalytic properties of nanowires consisting of semiconductors, noble and various other metals, metal oxides properties and metal alloys are presented. The applications of nanorods and nanowires are discussed in the book.

This book provides a comprehensive overview of the fundamentals of nanotoxicity modeling and its implications for the development of novel nanomedicines. It lays out the fundamentals of nanotoxicity modeling for an array of nanomaterial systems, ranging from carbon-based nanoparticles to noble metals, metal oxides, and quantum dots.

This book highlights the rapidly emerging field of solution-processed halide perovskite lasers. These amazing materials not only possess exceptional photovoltaic properties, but are also outstanding optical gain media. Halide perovskites are the latest member of solution-processed optical gain media, joining organics and traditional semiconductor colloidal quantum dots. Amplified spontaneous emission and lasing have been demonstrated in various halide perovskite configurations and nanostructures with wavelengths tunable over the visible and infrared wavelengths (400–1000 nm).